The BCM5673 is a dual-port switch equipped with a 10 Gigabit Ethernet and proprietary HiGig uplink ports. The former is a Xaui-based interconnect that complies with IEEE's CX-4 interface standard, thus allowing the new switching device to link up with Xenpak, X2, XFP and XPAK modules. The HiGig port is a proprietary Xaui-based interface that allows designers to link up with devices like the BCM5670 switch fabric device.
Developed in a 0.13-micron process, the BCM5673 operates from a 1.25-V core voltage and delivers 2.5- and 3.3-V tolerant I/Os. During normal operation, Broadcom said the chip dissipates approximately 4-W power. The BCM5673 is being offered a 480-pin FBGA package and is equipped with native support for the Linux, VxWorks and QNX operating systems. The device also delivers the same API as other members of the StrataXGX family, thus allowing designers to port existing software.